LIG3 anticorps (AA 2-115)

N° du produit ABIN968692

Cet anticorps Souris Monoclonal détecte spécifiquement LIG3 dans WB et IF. Il présente une réactivité envers Humain, Souris, Rat et Chien et a été mentionné dans 4+ publications.

Aperçu rapide pour LIG3 anticorps (AA 2-115) (ABIN968692)

Antigène: LIG3 (Ligase III, DNA, ATP-Dependent (LIG3))

Reactivité: Humain, Souris, Rat, Chien

Hôte: Souris

Clonalité: Monoclonal

Conjugué: Cet anticorp LIG3 est non-conjugé

Application: Western Blotting (WB), Immunofluorescence (IF)

Clone: 7-D Ligase III

Détail du produit anti-LIG3 anticorps

Épitope: AA 2-115

Réactivité croisée: Chien, Rat (Rattus), Souris

Attributs du produit: 1. Since applications vary, each investigator should titrate the reagent to obtain optimal results.
2. Please refer to us for technical protocols.
3. Source of all serum proteins is from USDA inspected abattoirs located in the United States.
4. Caution: Sodium azide yields highly toxic hydrazoic acid under acidic conditions. Dilute azide compounds in running water before discarding to avoid accumulation of potentially explosive deposits in plumbing.

Purification: The monoclonal antibody was purified from tissue culture supernatant or ascites by affinity chromatography.

Immunogène: Human DNA Ligase III aa. 2-115

Isotype: IgG1

Information d'application

Commentaires:

Related Products: ABIN968537, ABIN967389

Restrictions: For Research Use only

Stockage

Format: Liquid

Concentration: 250 μg/mL

Buffer: Aqueous buffered solution containing BSA, glycerol, and ≤0.09 % sodium azide.

Agent conservateur: Sodium azide

Précaution d'utilisation: This product contains Sodium azide: a POISONOUS AND HAZARDOUS SUBSTANCE which should be handled by trained staff only.

Stock: -20 °C

Stockage commentaire: Store undiluted at -20° C.

Références pour anticorps anti-LIG3 (ABIN968692)

Oei, Ziegler: "ATP for the DNA ligation step in base excision repair is generated from poly(ADP-ribose)." dans: The Journal of biological chemistry, Vol. 275, Issue 30, pp. 23234-9, (2000) (PubMed).

Taylor, Whitehouse, Caldecott: "The DNA ligase III zinc finger stimulates binding to DNA secondary structure and promotes end joining." dans: Nucleic acids research, Vol. 28, Issue 18, pp. 3558-63, (2000) (PubMed).

Mackey, Niedergang, Murcia, Leppard, Au, Chen, de Murcia, Tomkinson: "DNA ligase III is recruited to DNA strand breaks by a zinc finger motif homologous to that of poly(ADP-ribose) polymerase. Identification of two functionally distinct DNA binding regions within DNA ligase III." dans: The Journal of biological chemistry, Vol. 274, Issue 31, pp. 21679-87, (1999) (PubMed).

Chen, Tomkinson, Ramos, Mackey, Danehower, Walter, Schultz, Besterman, Husain: "Mammalian DNA ligase III: molecular cloning, chromosomal localization, and expression in spermatocytes undergoing meiotic recombination." dans: Molecular and cellular biology, Vol. 15, Issue 10, pp. 5412-22, (1995) (PubMed).

Détails sur LIG3

Antigène: LIG3 (Ligase III, DNA, ATP-Dependent (LIG3))

Autre désignation: DNA Ligase III

Sujet: Cells have evolved DNA repair pathways that are dedicated to the maintenance of DNA integrity. In such pathways, damaged DNA is excised and the resulting gap is filled by DNA polymerase. Human DNA ligases, ligase I, III, and IV, utilize ATP as a co-factor in DNA joining reactions required for base excision and single strand break repair pathways. All DNA ligases contain an RFPR sequence and an active site motif (ASM) on each side of their catalytic domain. The RFPR is required for transfer of an AMP group from the enzyme to the 5'-phosphate terminus of a DNA nick. In addition, DNA ligase III has an N-terminal zinc finger domain (ZFD) that is homoloqous with the zinc fingers found in poly(ADP-ribose) polymerase (PARP). This domain is not required for DNA ligase activity, but enables DNA ligase III to interact with single strand gaps and single strand flaps. During base excision repair (BER), ATP-dependent ligation requires PARP, DNA polymerase beta, and DNA ligase III interaction with XRCC1 within the BER complex. Thus, DNA ligase III may contain unique protein sequences that allow interaction and repair of specific types of DNA damage.

Poids moléculaire: 103 kDa

Pathways: Réparation de l'ADN